Windsor recently added a laser depaneling machine. The benefits include:

• No stress!
• No burrs!
• No particles!

The advances in laser technology and in mechanical engineering promise more precision in cutting and separating rigid, rigid-flex, and flexible PCBs and cover layers. Even with complex shapes, the UV laser cuts any contours with minimal tolerances directly from the layout data, without the limitations of tool-based processes. The attached exhaust system reliably gathers the ablation products. The clean cuttings of the LPKF MicroLine 2120P ensure there are practically no burrs or particles. The sensitive material is not mechanically stressed and even the heat-affected zone turns out to be very small – only a few micrometers. The material removed by the laser energy is automatically discharged by the integrated exhaust.

Stress-Free for Material and Operator

The UV laser cuts substrates in the immediate vicinity of sensitive components or strip conductors – without mechanical stress. Smaller components can thus be produced with a noticeably higher assembly density up to the edge of the PCB – and at the same time the process reduces the reject rate. The UV laser can also reliably cut components that are populated on two sides with a high level of mixed assembly. Since no mechanical forces have to be accommodated, the component fixtures turn out to be clearly less expensive in comparison to other processes.

To learn more about our new laser depaneling system, contact us.